Cooling & Thermal Paste

Key Specifications/Special Features: Descriptions: Syringe design, for easy operation Helps disperse the heat from CPU to heat sink effectively Suitable for: CPU heat sink or chip High temperature resistance Non-toxic, tasteless, non-corrosive Primary use: thermal coupling of electrical/electronic devices to heatsinks Special properties: high conductivity, low bleed, stable at high temperatures Specifications: Thermal conductivity: >1.896W/m-K…